Difficulty

Moderate

Steps

5

Time Required

                          10 minutes            

Sections

1

  • Vibrate Mechanism
  • 5 steps

Flags

0

  • BackHTC Evo 3D

  • Full Screen

  • Options

  • History

  • Save to Favorites

  • Download PDF

  • Edit

  • Translate

  • Get Shareable Link

  • Embed This Guide

  • Notify Me of Changes

  • Stop Notifications

Introduction

What you need

Step 1

              Vibrate Mechanism               
  • Remove the outer casing of the phone with your hands by prying and lifting at the latch.

Remove the outer casing of the phone with your hands by prying and lifting at the latch.

1024

Step 2

  • Remove the battery with your hands, lifting at the marked area.

Remove the battery with your hands, lifting at the marked area.

Step 3

  • Remove the SD card
  • Remove the four T5 screws using the corresponding screwdriver.
  • Remove the two J000 screws using the corresponding screwdriver.

Remove the SD card

Remove the four T5 screws using the corresponding screwdriver.

Remove the two J000 screws using the corresponding screwdriver.

Step 4

  • With the battery removed, the inner case of the phone can now be removed.
  • Using the plastic opening tool, pry the inner case off at the marked area. Continue prying around the entire perimeter of the phone.
  • This will remove the inner case, and allow access into the inner portion of the phone.
  • Be careful not rip or damage the ribbons inside this shell.

With the battery removed, the inner case of the phone can now be removed.

Using the plastic opening tool, pry the inner case off at the marked area. Continue prying around the entire perimeter of the phone.

This will remove the inner case, and allow access into the inner portion of the phone.

Be careful not rip or damage the ribbons inside this shell.

Step 5

  • The vibrating mechanism is located on the motherboard, on the right.
  • The marked part is the vibrating mechanism.
  • To remove the vibrating mechanism, use the tweezers to securely hold the wire and tug on it.
  • The vibrating unit can then be disconnected from the motherboard using the tweezers, grasping the white part.

The vibrating mechanism is located on the motherboard, on the right.

The marked part is the vibrating mechanism.

To remove the vibrating mechanism, use the tweezers to securely hold the wire and tug on it.

The vibrating unit can then be disconnected from the motherboard using the tweezers, grasping the white part.

To reassemble your device, follow these instructions in reverse order.

Cancel: I did not complete this guide.

Author

                                      with 3 other contributors 

                    James Burke                     

Member since: 08/26/2015

245 Reputation

                                      2 Guides authored                  



                       Badges:
                       6







                                                        +3 more badges                           

Team

                       USF Tampa, Team 14-20, Meier Fall 2015                        

                                                  Member of USF Tampa, Team 14-20, Meier Fall 2015 



                    USFT-MEIER-F15S14G20                     


                                            5 Members                     


                                            10 Guides authored